This curable materials could be used in organic encapsulant. 此材料可以做为有机封装材。
Buried Service Wire Splice A watertight splice filled with an encapsulant. 地下服务导线接头一种填充了密封剂的不漏水的接头。
DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA. 简介：道尔DU901是一种单组分环氧密封剂，用于CSP或BGA底部填充制程。
The thermal and mechanical properties of the modified epoxy encapsulant were introduced. 并对改性后封装料的结构、热性能和机械性能作了详细介绍。
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use. 凯斯特骄傲地宣布,它已获得回流密封剂技术(其中包括材料和使用方法)的专利。
The P-V-T-C equation of underfill encapsulant was developed by employing the thermal analyzer and statistical technique. 并且配合统计的技巧建立出一个压力-体积-温度-熟化度的关系式(P-V-T-C关系式)。
